aries land grid array socket, 16x16 grid, 256 pin, [.050] 1.27 pitch note: aries specializes in custom design and production. in addition to the standard products shown on this page, special materials, platings, sizes, and configurations can be furnished, depending on quantities. aries reserves the right to change product specifications without notice. features: ? uses same surface mount soldering technology as bga devices. ? lga device is accurately aligned and seated in socket base prior to mounting of top. ? controlled contact deflection. ? simple mounting hardware requiring standard tools. ? intergral blind surface mount inserts in the base solder to top side of pcb and intergral flanged threaded inserts provide ample mounting pressure on device to eliminate need for backing plate on bottom side of pcb. also reduces strain on solder ball terminations. ? open window or metal top for heat sink application available as a special feature. specifications: ? base and lid are ul 94v-0 glass filled lcp; color=natural. ? contacts are heat treated beryllium copper alloy per qq-c-533. ? contact plating is 30 m [.76 m m] min. gold per mil-g-45204 over 30-50 m [.76-1.27 m m] min. nickel per qq-n-290. ? solder ball terminations are 90/10 lead/tin. ? solder paste is 63/37 eutectic. ? solder mask is dryfilm. ? hardware consists of tin/nickel plated blind & #2-56 threaded inserts and stainless steel slotted screws. ? self inductance=1.50nh/contact @ 100mhz per eia 364, test proc. 69. ? capacitance=<1pf/contact @ 100mhz per eia 364, test proc. 30. ? contact resistance=20mohms max. ? durability=20 cycles min. ? contact normal force=40-50 grams/contact @ .008-.010 deflection. ? currently under qualification testing per eia/is-701 and ibms lga certification requirements specification, version 5.0. mounting considerations: ? see suggested pcb layout below. a ll dimensions : inches [ millimeters ] xxx-lgaxxxxx-xx ordering informa tion all tolerances .005 [.13] unless otherwise specified no. of pins suggested pcb la yout aries lga cont act assembl y pitch: v=.050 [1.27] (standard) w=.039 [1.00] (consult factory) plating: 0=tin (consult factory) 1=gold (standard) footprint designator (assigned by factory) land grid array note: 256-lga16001-v1 depicted here. consult factory for details. covered by patents and/or patents applied for. north america frenchtown, nj usa tel: (908) 996-6841 fax: (908) 996-3891 uk/ireland/gb tel: +44 870 240 0249 fax: +44 1653 600493 uking@arieselec.com europe/mainland/holland tel: +31 78 615 94 65 fax: +31 78 615 43 11 europe@arieselec.com http://www.arieselec.com ? info@arieselec.com printouts of this document may be out of date and should be considered uncon trolled 23014 rev.b
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